WELCOME TO BOIN GMBH

Tomerdingen (Germany) - For immediate release - December 03, 2001

Boin GmbH, a software manufacturer for the semiconductor industry, announced today that it has selected Altsoft, Inc. as its Korean distribution partner for WAFERMAP and WAFERMAP-View.OCX. Together, Boin and Altsoft will focus on increasing Boin’s Korean market penetration by targeting end users and OEM customers.

WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram. The software is already in use on a worldwide basis at more than 80 IC and semiconductor equipment companies as well as wafer suppliers and research institutes. Among IC manufacturers, the software is used during production of analog, mixed-signal, DRAM and other integrated circuits including microprocessors and communications chips for the computer and telecommunications industries. It is used for production and testing of both silicon (Si) and gallium arsenide (GaAs) integrated circuits.

WAFERMAP-View.OCX is a software development kit for both the semiconductor and disk drive industry. It offers the 7 different types of graphics of WAFERMAP for Win95/ NT as an ActiveX control. It allows software developers to use Boin´s innovative plot techniques to develop their own data analysis and visualization tools. 1D, 2D and 3D graphs and histograms can easily be integrated into existing applications.

A free Evaluation Copy of WAFERMAP can be downloaded at Download.

Contact:

Boin GmbH, Dr. Manuela Boin
E-Mail: info@boin-gmbh.com
Web: www.boin-gmbh.com
Tel: +49 (0) 7348-928233

Altsoft, Inc., KiJung Min
E-Mail: altsoft@altsoft.co.kr
Web: www.altsoft.co.kr
Tel: 822-547-2344
Fax: 822-547-2343