PRESS RELEASES

Tomerdingen (Germany) - For immediate release - August 18, 1998

Boin GmbH has released the Windows 95/ NT version of the WAFERMAP metrology software package. WAFERMAP allows to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. It can import raw data files from various metrology tools such as ellipsometers or four point probes. Supported data formats include equipment from KLA-Tencor, Rudolph, Thermawave, SOPRA, Philips Analytical and others. Data files can be visualized by configurable line scans, contour plots, 3D plots, sigma range plots and histograms.

Several kinds of operations can be applied to wafer maps such as rotation, shift or mirroring of the grid. Global operations such as adding, subtracting, square etc. can be carried out. Different sets of data can be compared by adding, subtracting or dividing complete wafer maps. An easy-to-use wafer data editor is incorporated in the package allowing the user to manipulate the data.

A module for Statistical Process Control (SPC) is implemented offering trend charts, trend lists and an advanced file browser. WAFERMAP can be used to analyze and print wafer maps outside the cleanroom, which is necessary in paperless IC manufacturing environments. For manual operated metrology equipment it is possible to automatically create circular and cartesian grids with configurable resolution as well as user defined grids.

A free Evaluation Copy of WAFERMAP can be downloaded at Download.

Contact:

Boin GmbH, Dr. Manuela Boin
E-Mail: info@boin-gmbh.com
Web: www.boin-gmbh.com
Tel: +49 (0) 7348-928233