MORE INFO
"New Methods of Metrology Data Analysis During Semiconductor Processing and Application to Rapid Thermal Processing" | Dr. Manuela Boin, Boin GmbH, Dr. Wilfried Lerch, STEAG AST Elektronik GmbH EMRS Spring Meeting, Symposium I (Rapid Thermal Processing), June 16-19, 1998, Strasbourg, France. If you want to receive a reprint please send us an email. |
---|---|
"Application of Metrology Data Processing and Analysis to Rapid Thermal Processing" | Dr. Manuela Boin, Boin GmbH, Dr. Wilfried Lerch, STEAG AST Elektronik GmbH Presented at 6th International Conference on Advanced Thermal Processing of Semiconductors, RTP'98, September 9-11, 1998, Kyoto, Japan. If you want to receive a reprint please send us an email. |