WELCOME TO BOIN GMBH

General
  • Advanced xml-based Boin multi-column multi-wafer file format
  • Loading of multiple columns and wafers at once
  • Configurable 1D- (line scan), 2D- (contour or colored), and value plots
  • Configurable 3D- (solid or wire frame), 3D bar chart, and sigma range plots
  • Statistical analysis (histogram, calculation of mean, standard deviation, max, min, etc.)
  • Import functions for data from metrology tools (e.g. 4 Dimensions, AIT CMT 5000, AMS SRD/MRD, Bruker AXS, CDE ResMap, FILMetrics, HRP-250, KLA Tencor RS 100, KLA Tencor F5 Ellipsometer, Nanophotonics, Napson WS300, Nicolet, Nova 2040, Plasmos, Prometrix Rs, Prometrix UV-1250, QC Solutions, Rigaku, Rudolph, Rudolph Metapulse, Semitek, Sentech, SOPRA SE, SpectraFilm F1, OMS, OMT, Thermawave Optiprobe and Thermaprobe, TWIN)
  • Import of data from metrology tools which directly write WAFERMAP format (e.g. E & H, Foothill, Hypernex, ISIS Optronics, Jenoptik, Jobin Yvon, Sigmatech, Tepla)
  • Other import functions (e.g. ASCII files, OPUS)
  • Definition of any site pattern using a graphic editor
  • Automatic generation of circular or Cartesian site patterns for any test diameter
  • Extensive on-line help and HTML based user manual
SPC
  • Trend charts
  • Trend lists
  • Global Statistics ("All points, all wafers")
  • Browser
  • Trend charts and lists can be sorted by any criterion (date & time, mean, max, min, std.dev. etc.)
  • Calculation of Stacked Maps
  • Operations with files
  • Direct import of measurement files into the SPC tool
Operations
  • Global operations (add, subtract, divide, square, square root, etc.)
  • 1st and 2nd derivative of a map
  • File compare operations (add, multiply, ratio, average etc.)
  • File operations are applicable to files with different site distributions
  • Shift (X and Y direction) and rotation of grids
  • Mirroring of maps along the X and Y axis
  • Averaging of radial zones
  • Multiple files can be open simultaneously
  • Multiple views of a single file can be selected and displayed simultaneously
  • Multiple views can be printed on a single sheet, printouts are configurable including company logo
  • Transformation of grids (Cartesian, circular) keeping same measurement feature
  • Merge data of different files (e.g. two measurements of one wafer)
  • Sigma Sorting Filter (1, 2, 3 sigma)
  • Interpolation of sites
Communication / Linking
  • Inter-application communication via DCOM (ActiveX server)
  • Advanced control of WAFERMAP can be achieved via DDE linking to another application (availability depending on OS)